A method of manufacturing an integrated lead head suspension flexure of the type having conductors on a spring metal layer (20) capable of being etched by a first etching process. The method includes forming a patterned layer having gaps one or more flying lead regions (50) of dielectric material (24) on a major surface of the spring metal layer (20) and forming one or more conductive leads (40) on the flexure, including onto the dielectric material (24) and over exposed spring metal at the gap at each flying lead region (50). At least the flying lead portion (50) of the conductive lead (40) is formed from conductive material resistant to the first etching process. The method also includes etching a flying lead region (50) of the spring metal layer (20) to remove a portion of the spring metal layer (20) in the flying lead region (50) and expose the flying lead portions (50) of the conductive lead (40).