Invention Application
WO2006001402A1 METHOD OF SOLDERING ELECTRONIC COMPONENT HAVING SOLDER BUMPS TO SUBSTRATE
审中-公开
将焊接的电子元件焊接到基板上的方法
- Patent Title: METHOD OF SOLDERING ELECTRONIC COMPONENT HAVING SOLDER BUMPS TO SUBSTRATE
- Patent Title (中): 将焊接的电子元件焊接到基板上的方法
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Application No.: PCT/JP2005/011690Application Date: 2005-06-21
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Publication No.: WO2006001402A1Publication Date: 2006-01-05
- Inventor: SAKAI, Tadahiko , MAEDA, Tadashi
- Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , SAKAI, Tadahiko , MAEDA, Tadashi
- Applicant Address: 1006, Oaza Kadoma, Kadoma-shi, Osaka, 5718501 JP
- Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.,SAKAI, Tadahiko,MAEDA, Tadashi
- Current Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.,SAKAI, Tadahiko,MAEDA, Tadashi
- Current Assignee Address: 1006, Oaza Kadoma, Kadoma-shi, Osaka, 5718501 JP
- Agency: IWAHASHI, Fumio et al.
- Priority: JP2004-186092 20040624; JP2004-320233 20041104
- Main IPC: H05K3/34
- IPC: H05K3/34
Abstract:
A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.
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