Invention Application
- Patent Title: TRANSMISSION LINE IMPEDANCE MATCHING
- Patent Title (中): 传输线阻抗匹配
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Application No.: PCT/US2005/020452Application Date: 2005-06-09
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Publication No.: WO2006007360A1Publication Date: 2006-01-19
- Inventor: KIM, Hyunjun , KIM, Joong-Ho , HAN, Dong-Ho , HE, Jiangqi
- Applicant: INTEL CORPORATION , KIM, Hyunjun , KIM, Joong-Ho , HAN, Dong-Ho , HE, Jiangqi
- Applicant Address: 2200 Mission College Boulevard, Santa Clara, CA 95052 US
- Assignee: INTEL CORPORATION,KIM, Hyunjun,KIM, Joong-Ho,HAN, Dong-Ho,HE, Jiangqi
- Current Assignee: INTEL CORPORATION,KIM, Hyunjun,KIM, Joong-Ho,HAN, Dong-Ho,HE, Jiangqi
- Current Assignee Address: 2200 Mission College Boulevard, Santa Clara, CA 95052 US
- Agency: VINCENT, Lester, J. et al.
- Priority: US10/880,637 20040629
- Main IPC: H01P3/08
- IPC: H01P3/08
Abstract:
Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The nontransmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.
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