A low heat resistant surface mounting component bonded to a circuit board is removed therefrom without affecting the performance of the circuit board and that the low heat resistant surface mounting component. Solder bumps (3) located on the surface of a low heat resistant surface mounting component (1) in the vicinity (2) of the outer circumference thereof are formed of a low melting point solder as compared with bumps (3) located in the vicinity of the central part. When the low heat resistant surface mounting component (1) on the circuit board is heated locally and removed by fusing the solder bumps, heating temperature in the vicinity of the outer circumference is low as compared with that in the vicinity of the central part. Solder bumps of low melting point solder are thereby employed in the vicinity of the outer circumference so that the solder bumps fuse even at such a low heating temperature. Consequently, the solder bumps on the entire surface of the low heat resistant surface mounting component (1) fuse.