Invention Application
WO2006060229A1 NANOCOMPOSITES COMPRISING TELECHELIC POLYESTERS AND ORGANOCLAYS
审中-公开
包含电话聚酯和有机硅的纳米复合材料
- Patent Title: NANOCOMPOSITES COMPRISING TELECHELIC POLYESTERS AND ORGANOCLAYS
- Patent Title (中): 包含电话聚酯和有机硅的纳米复合材料
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Application No.: PCT/US2005/042269Application Date: 2005-11-18
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Publication No.: WO2006060229A1Publication Date: 2006-06-08
- Inventor: BRUNELLE, Daniel, Joseph , COLONNA, Martino , BERTI, Corrado , FIORINI, Maurizio
- Applicant: GENERAL ELECTRIC COMPANY , BRUNELLE, Daniel, Joseph , COLONNA, Martino , BERTI, Corrado , FIORINI, Maurizio
- Applicant Address: 1 River Road, Schenectady, NY 12345 US
- Assignee: GENERAL ELECTRIC COMPANY,BRUNELLE, Daniel, Joseph,COLONNA, Martino,BERTI, Corrado,FIORINI, Maurizio
- Current Assignee: GENERAL ELECTRIC COMPANY,BRUNELLE, Daniel, Joseph,COLONNA, Martino,BERTI, Corrado,FIORINI, Maurizio
- Current Assignee Address: 1 River Road, Schenectady, NY 12345 US
- Agency: WINTER, Catherine, J. et al.
- Priority: US11/001,214 20041201
- Main IPC: C08K3/34
- IPC: C08K3/34 ; C08L67/02 ; C08K9/04
Abstract:
Nanocomposite compositions comprising organoclays and telechelic polyesters that contain sulfonate end groups were prepared that resulted in improved physical and mechanical properties.
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