Invention Application
- Patent Title: METHOD OF MOLDING A MICRONEEDLE
- Patent Title (中): 模制麦克风的方法
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Application No.: PCT/US2005/044121Application Date: 2005-12-07
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Publication No.: WO2006062974A2Publication Date: 2006-06-15
- Inventor: FERGUSON, Dennis, E. , NAYAR, Satinder, K. , POCHARDT, Donald, L.
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY , FERGUSON, Dennis, E. , NAYAR, Satinder, K. , POCHARDT, Donald, L.
- Applicant Address: 3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427 US
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY,FERGUSON, Dennis, E.,NAYAR, Satinder, K.,POCHARDT, Donald, L.
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY,FERGUSON, Dennis, E.,NAYAR, Satinder, K.,POCHARDT, Donald, L.
- Current Assignee Address: 3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427 US
- Agency: CANTOR, Adam, S. et al.
- Priority: US60/634,319 20041207
- Main IPC: B29C45/56
- IPC: B29C45/56 ; A61M37/00
Abstract:
A method of molding a microneedle using a mold apparatus that comprises a mold insert having the negative image of at least one microneedle, a compression core, and a mold housing configured to allow a reciprocal motion between the mold insert and the compression core. The mold apparatus has an open position and a closed position. The mold apparatus is placed in the closed position and polymeric material is injected into the closed mold apparatus. The injected polymeric material is compressed between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert. Also, molding methods wherein the mold apparatus has sidewalls having an injection gate. Also, molding methods comprising a heated mold insert. Also, molding methods comprising the application of high frequency acoustic energy, such as ultrasonic energy, to the mold apparatus.
Information query
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