Invention Application
WO2006081004A2 METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM
审中-公开
减少等离子体处理系统中的副产物沉积的方法和装置
- Patent Title: METHODS AND ARRANGEMENT FOR THE REDUCTION OF BYPRODUCT DEPOSITION IN A PLASMA PROCESSING SYSTEM
- Patent Title (中): 减少等离子体处理系统中的副产物沉积的方法和装置
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Application No.: PCT/US2005/045729Application Date: 2005-12-16
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Publication No.: WO2006081004A2Publication Date: 2006-08-03
- Inventor: LOHOKARE, Shrikant, P. , BAILEY, Andrew, D, III
- Applicant: LAM RESEARCH CORPORATION , LOHOKARE, Shrikant, P. , BAILEY, Andrew, D, III
- Applicant Address: 4650 Cushing Parkway, Fremont, California 94538 US
- Assignee: LAM RESEARCH CORPORATION,LOHOKARE, Shrikant, P.,BAILEY, Andrew, D, III
- Current Assignee: LAM RESEARCH CORPORATION,LOHOKARE, Shrikant, P.,BAILEY, Andrew, D, III
- Current Assignee Address: 4650 Cushing Parkway, Fremont, California 94538 US
- Agency: NGUYEN, Joseph, A
- Priority: US11/022,982 20041222
- Main IPC: H05H1/24
- IPC: H05H1/24 ; C23C16/00
Abstract:
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
Information query
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