To provide a hot melt adhesive composition which has significantly reduced stringing and is superior in thermal stability and clarity. A hot melt adhesive composition contains a first component comprising at least one ethylene/C 3 - C 20 a-olefin copolymer; a second component comprising at least one ethylene/(meth)acrylic acid ester copolymer in an amount of 6 to 12 parts by weight per 100 parts by weight of the first component; and a third component comprüsing at least one tackifying resin, in an amount of 50 to 200 parts by weight per 100 parts by weight of the first component, the third component being compatible with the first and second components.