Invention Application
- Patent Title: ROUTINGLESS CHIP ARCHITECTURE
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Application No.: PCT/US2006/023362Application Date: 2006-06-14
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Publication No.: WO2006138490A3Publication Date: 2006-12-28
- Inventor: TREZZA, John , MISRA, Abhay
- Applicant: CUBIC WAFER, INC. , TREZZA, John , MISRA, Abhay
- Applicant Address: 10 Al Paul Lane Merrimack, NH 03054 US
- Assignee: CUBIC WAFER, INC.,TREZZA, John,MISRA, Abhay
- Current Assignee: CUBIC WAFER, INC.,TREZZA, John,MISRA, Abhay
- Current Assignee Address: 10 Al Paul Lane Merrimack, NH 03054 US
- Agency: STRAUSSMAN, Richard
- Priority: US60/690,759 20050614; US11/329,540 20060110
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of creating a unified chip involves performing front-end processing on a first wafer, the front end processing creating multiple devices on the wafer, performing back- end processing on a second wafer, the back end processing creating layers of interconnected metal traces arranged to interconnect at least some of the multiple devices to each other, and bonding the first wafer to the second wafer such that the multiple devices on the first wafer are interconnected to each other by the metal traces of the second wafer.
Information query
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