Invention Application
WO2007058854A2 SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
审中-公开
半导体封装，包括具有重新分配的焊盘的半导体器件
- Patent Title: SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
- Patent Title (中): 半导体封装，包括具有重新分配的焊盘的半导体器件
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Application No.: PCT/US2006/043520Application Date: 2006-11-10
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Publication No.: WO2007058854A2Publication Date: 2007-05-24
- Inventor: PAVIER, Mark , SAWLE, Andrew M. , STANDING, Martin
- Applicant: INTERNATIONAL RECTIFIER CORPORATION , PAVIER, Mark , SAWLE, Andrew M. , STANDING, Martin
- Applicant Address: 233 Kansas Street, El Segundo, California 90245 US
- Assignee: INTERNATIONAL RECTIFIER CORPORATION,PAVIER, Mark,SAWLE, Andrew M.,STANDING, Martin
- Current Assignee: INTERNATIONAL RECTIFIER CORPORATION,PAVIER, Mark,SAWLE, Andrew M.,STANDING, Martin
- Current Assignee Address: 233 Kansas Street, El Segundo, California 90245 US
- Agency: SALEHI, Kourosh et al.
- Priority: US60/736,003 20051110
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.
Information query
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