A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb) - free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. The further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.