SEMICONDUCTOR DEVICE FABRICATED USING A CARBON-CONTAINING FILM AS A CONTACT ETCH STOP LAYER

Invention Application

WO2007106814A3 SEMICONDUCTOR DEVICE FABRICATED USING A CARBON-CONTAINING FILM AS A CONTACT ETCH STOP LAYER 审中-公开

Title translation: 使用含碳膜作为接触蚀刻停止层制成的半导体器件

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Patent Title: SEMICONDUCTOR DEVICE FABRICATED USING A CARBON-CONTAINING FILM AS A CONTACT ETCH STOP LAYER
Patent Title (中): 使用含碳膜作为接触蚀刻停止层制成的半导体器件
Application No.: PCT/US2007063888

Application Date: 2007-03-13
Publication No.: WO2007106814A3

Publication Date: 2008-09-25
Inventor: BU HAOWEN , KRISHNAN ANAND T , TSUI TING Y , DOSTALIK WILLIAM W , KHAMANKAR RAJESH
Applicant: TEXAS INSTRUMENTS INC , BU HAOWEN , KRISHNAN ANAND T , TSUI TING Y , DOSTALIK WILLIAM W , KHAMANKAR RAJESH
Assignee: TEXAS INSTRUMENTS INC,BU HAOWEN,KRISHNAN ANAND T,TSUI TING Y,DOSTALIK WILLIAM W,KHAMANKAR RAJESH
Current Assignee: TEXAS INSTRUMENTS INC,BU HAOWEN,KRISHNAN ANAND T,TSUI TING Y,DOSTALIK WILLIAM W,KHAMANKAR RAJESH
Priority: US37463506 2006-03-13
Main IPC: H01L21/8234
IPC: H01L21/8234

SEMICONDUCTOR DEVICE FABRICATED USING A CARBON-CONTAINING FILM AS A CONTACT ETCH STOP LAYER

Abstract:

The invention provides, one aspect, a method of fabricating a semiconductor device (100). In one aspect, the method includes forming a carbide layer (170) over a gate electrode (150) and depositing a pre-metal dielectric layer (175) over the carbide layer. The method provides a significant reduction in NBTI (negative bias temperature instability) drift.

Abstract(Chinese):

本发明提供一个方面，一种制造半导体器件（100）的方法。一方面，该方法包括在栅电极（150）上形成碳化物层（170），并在碳化物层上沉积预金属介电层（175）。该方法显着降低了NBTI（负偏压温度不稳定性）漂移。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺