Invention Application
- Patent Title: CONDUCTIVE STIFFENER FOR A FLEXIBLE SUBSTRATE
- Patent Title (中): 用于柔性基板的导电型强化器
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Application No.: PCT/US2007067674Application Date: 2007-04-27
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Publication No.: WO2007130870A3Publication Date: 2008-08-28
- Inventor: GRAYDON BHRET , FRANDRUP STEVE
- Applicant: FLEXTRONICS AP LLC , GRAYDON BHRET , FRANDRUP STEVE
- Assignee: FLEXTRONICS AP LLC,GRAYDON BHRET,FRANDRUP STEVE
- Current Assignee: FLEXTRONICS AP LLC,GRAYDON BHRET,FRANDRUP STEVE
- Priority: US38109306 2006-05-01
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A structure is disclosed for connecting an electrically-connectable metal stiffener (402) to a ground connection within a flexible substrate (102), the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non- conducting adhesive (110) which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy (302). A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
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