DIGITAL ALLOYS AND METHODS FOR FORMING THE SAME

Invention Application

WO2007136841A3 DIGITAL ALLOYS AND METHODS FOR FORMING THE SAME 审中-公开

Title translation: 数字合金及其形成方法

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Patent Title: DIGITAL ALLOYS AND METHODS FOR FORMING THE SAME
Patent Title (中): 数字合金及其形成方法
Application No.: PCT/US2007012096

Application Date: 2007-05-18
Publication No.: WO2007136841A3

Publication Date: 2008-08-07
Inventor: HU EVELYN , BELCHER ANGELA , QUAN XINA
Applicant: CAMBRIOS TECHNOLOGIES CORP , HU EVELYN , BELCHER ANGELA , QUAN XINA
Assignee: CAMBRIOS TECHNOLOGIES CORP,HU EVELYN,BELCHER ANGELA,QUAN XINA
Current Assignee: CAMBRIOS TECHNOLOGIES CORP,HU EVELYN,BELCHER ANGELA,QUAN XINA
Priority: US80179206 2006-05-19; US67972607 2007-02-27
Main IPC: H01L21/20
IPC: H01L21/20 ; H01L31/0216 ; H01M4/00 ; H01M4/50 ; H01M10/36

DIGITAL ALLOYS AND METHODS FOR FORMING THE SAME

Abstract:

Alloys of tunable compositions and corresponding optical, electrical and mechanical properties are described. Also described are their uses in optoelectronic devices and material interfaces.

Abstract(Chinese):

描述了可调谐组合物的合金和相应的光学，电学和机械性能。还描述了它们在光电子器件和材料界面中的用途。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/20	....半导体材料在基片上的沉积，例如外延生长