Invention Application
WO2008010626A1 OPTICAL SENSOR MODULE FOR OPTICAL POINTING DEVICE AND METHOD OF FABRICATING THE SAME
审中-公开
用于光学点装置的光学传感器模块及其制造方法
- Patent Title: OPTICAL SENSOR MODULE FOR OPTICAL POINTING DEVICE AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 用于光学点装置的光学传感器模块及其制造方法
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Application No.: PCT/KR2006/004659Application Date: 2006-11-08
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Publication No.: WO2008010626A1Publication Date: 2008-01-24
- Inventor: JEONG, Wan-Gyo , LEE, Bang-Won , HONG, Sung-Hyuk
- Applicant: ATLAB INC. , JEONG, Wan-Gyo , LEE, Bang-Won , HONG, Sung-Hyuk
- Applicant Address: 3rd Fl., Seokam Bldg. 1082-12 Poongduckcheon-dong Yongin-si Gyeonggi-do 449-170 KR
- Assignee: ATLAB INC.,JEONG, Wan-Gyo,LEE, Bang-Won,HONG, Sung-Hyuk
- Current Assignee: ATLAB INC.,JEONG, Wan-Gyo,LEE, Bang-Won,HONG, Sung-Hyuk
- Current Assignee Address: 3rd Fl., Seokam Bldg. 1082-12 Poongduckcheon-dong Yongin-si Gyeonggi-do 449-170 KR
- Agency: PARK, Sang-Soo
- Priority: KR10-2006-0068049 20060720
- Main IPC: G06F3/033
- IPC: G06F3/033
Abstract:
An optical sensor module for an optical pointing device and a method of fabricating the same are provided. The optical sensor includes: a lead frame having a light receiving hole formed in a pad; an image sensor attached to the pad and detecting light emitted from a light source through the light receiving hole; and a molding member for integrally molding the lead frame and the image sensor. The method includes: forming a light receiving hole in a pad of a lead frame; attaching an image sensor to the pad; connecting the image sensor to a lead of the lead frame by bonding using a wire; molding the lead frame and the image sensor; and trimming the lead of the lead frame to a certain length and forming the lead.
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