Invention Application
- Patent Title: THIN-FILM EAS AND RFID ANTENNAS
- Patent Title (中): 薄膜和RFID天线
-
Application No.: PCT/US2007/017734Application Date: 2007-08-08
-
Publication No.: WO2008019157A1Publication Date: 2008-02-14
- Inventor: BERGMAN, Adam, S. , HALL, Stewart, E. , SOTO, Manuel, A.
- Applicant: SENSORMATIC ELECTRONICS CORPORATION
- Applicant Address: 6600 Congress Avenue Boca Raton, FL 33487 US
- Assignee: SENSORMATIC ELECTRONICS CORPORATION
- Current Assignee: SENSORMATIC ELECTRONICS CORPORATION
- Current Assignee Address: 6600 Congress Avenue Boca Raton, FL 33487 US
- Agency: CONA, Frank, A. et al.
- Priority: US11/501,499 20060808
- Main IPC: H01Q7/00
- IPC: H01Q7/00 ; H01Q1/40 ; H01Q7/06
Abstract:
An antenna assembly is capable of being installed in a structure wherein the structure includes a covering and a substructure and the antenna assembly is configured with thin film materials to have a total thickness such that the antenna assembly can be disposed between the substructure and the covering. The antenna assembly may have a total thickness not greater than about 15 millimeters (mm), and may include at least one of a transmitter antenna, a transceiver antenna, and a receiver antenna. The receiver antenna may be configured as an air core antenna or a non-air core antenna. The receiver antenna may be configured as a non-air core receiver antenna in an internal compartment over or within a base insulating layer. The antenna assembly may be at least partially housed within a housing assembly of thin film materials so that both can be disposed between the substructure and the covering.
Information query