A printed multilayer electronic circuit has printed electronic components on a first level circuit. Electrical conductors 130 are printed on the first level circuit, electrically connected to the electronic components 120. A layer of dielectric material 140 is printed over the printed electrical conductors 130. The dielectric layer 140 contains apertures 150 that extend vertically through the dielectric layer down to the electrical conductors. A second set of electrical conductors 160 are then printed on the dielectric layer, situated around the apertures 150. Electrically conductive material 170 is printed in the apertures so that an electrical connection is made from the second set of electrical conductors 160 to the electrical conductors 130 on the lower level. A second level circuit having additional electronic components 180 is then formed on the dielectric layer and the second set of conductors.