Invention Application
- Patent Title: HYBRID SOLDER PAD
- Patent Title (中): 混合焊膏
-
Application No.: PCT/US2006/061137Application Date: 2006-11-21
-
Publication No.: WO2008127219A1Publication Date: 2008-10-23
- Inventor: BROWN, Matthew R.
- Applicant: MOTOROLA INC. , BROWN, Matthew R.
- Applicant Address: 1303 East Algonquin Road Schaumburg, Illinois 60196 US
- Assignee: MOTOROLA INC.,BROWN, Matthew R.
- Current Assignee: MOTOROLA INC.,BROWN, Matthew R.
- Current Assignee Address: 1303 East Algonquin Road Schaumburg, Illinois 60196 US
- Agency: NOSKOWICZ, David N. et al.
- Priority: US11/285,001 20051122
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Disclosed herein is a solder pad interface for a solder joint on a substrate. The solder pad interface includes a soldermask defined (SMD) interface between a solder pad (202) and the substrate, and a non-soldermask defined (NSMD) interface between the solder pad and the solder joint. The SMD interface can include a layer of insulating material (208) configured as an overlaid stencil with apertures through which the NSMD interface of the solder pad is substantially accessible. The SMD interface can include a soldermask (210) configured to cover an outer portion (212) of the solder pad. The NSMD interface includes a raised central portion (214) of the solder pad having a top. The layer of insulating material can be substantially flush with the top of the raised central portion. The raised central portion can provide the NSMD interface between the solder pad and the solder joint.
Information query
IPC分类:
