Invention Application
- Patent Title: COMPONENT WITH MECHANICALLY LOADABLE CONNECTION SURFACES
- Patent Title (中): 与机械弹性连接区域组件
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Application No.: PCT/EP2008056200Application Date: 2008-05-20
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Publication No.: WO2008142081A3Publication Date: 2009-03-05
- Inventor: MAIER MARTIN , OBESSER MICHAEL , KASTNER KONRAD , PORTMANN JUERGEN , BAUERNSCHMITT ULRICH
- Applicant: EPCOS AG , MAIER MARTIN , OBESSER MICHAEL , KASTNER KONRAD , PORTMANN JUERGEN , BAUERNSCHMITT ULRICH
- Assignee: EPCOS AG,MAIER MARTIN,OBESSER MICHAEL,KASTNER KONRAD,PORTMANN JUERGEN,BAUERNSCHMITT ULRICH
- Current Assignee: EPCOS AG,MAIER MARTIN,OBESSER MICHAEL,KASTNER KONRAD,PORTMANN JUERGEN,BAUERNSCHMITT ULRICH
- Priority: DE102007023590 2007-05-21
- Main IPC: H01L23/485
- IPC: H01L23/485
Abstract:
The invention relates to a component with multi-layered connection surfaces that can be soldered or bonded to a substrate (SU). Said component has, in addition to the electrically conductive pad metallisation (PM) and the UBM-metallisation (UBM), an electrically conductive stress compensation layer (SK) that is arranged between the substrate and pad-metallisation or between the pad-metallisation and the UBM-metallisation. The stress insensitivity of the connection metallisation is obtained by a stress compensation layer, the E-module thereof being lower than that of the UBM-metallisation.
Public/Granted literature
- WO2008142081A9 COMPONENT WITH MECHANICALLY LOADABLE CONNECTION SURFACES Public/Granted day:2009-04-23
Information query
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