Invention Application
- Patent Title: EXPANSION SLOTS FOR THE THERMOMECHANICAL RELIEF OF AN ELECTRICAL CONTACT
- Patent Title (中): 电接点热机械安全装置
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Application No.: PCT/EP2008059058Application Date: 2008-07-11
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Publication No.: WO2009010457A3Publication Date: 2009-04-30
- Inventor: SCHWARZBAUER HERBERT
- Applicant: SIEMENS AG , SCHWARZBAUER HERBERT
- Assignee: SIEMENS AG,SCHWARZBAUER HERBERT
- Current Assignee: SIEMENS AG,SCHWARZBAUER HERBERT
- Priority: DE102007033465 2007-07-18
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/498
Abstract:
The aim of the invention is to thermomechanically relieve a layer stack which consists of an insulation foil and a flat strip conductor. According to the invention, elongate expansion slots are provided in the vicinity of the through contacts through the insulation foil.
Information query
IPC分类:
