Invention Application
WO2009039216A1 NEUTRAL LIGAND CONTAINING PRECURSORS AND METHODS FOR DEPOSITION OF A METAL CONTAINING FILM
审中-公开
含有前驱体的中性配体和含金属膜的沉积方法
- Patent Title: NEUTRAL LIGAND CONTAINING PRECURSORS AND METHODS FOR DEPOSITION OF A METAL CONTAINING FILM
- Patent Title (中): 含有前驱体的中性配体和含金属膜的沉积方法
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Application No.: PCT/US2008/076732Application Date: 2008-09-17
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Publication No.: WO2009039216A1Publication Date: 2009-03-26
- Inventor: JURCIK, Benjamin , DUSSARRAT, Christian
- Applicant: L'AIR LIQUIDE - SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE , JURCIK, Benjamin , DUSSARRAT, Christian
- Applicant Address: 75 quai d'Orsay F-75321 Cedex 07 Paris FR
- Assignee: L'AIR LIQUIDE - SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE,JURCIK, Benjamin,DUSSARRAT, Christian
- Current Assignee: L'AIR LIQUIDE - SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE,JURCIK, Benjamin,DUSSARRAT, Christian
- Current Assignee Address: 75 quai d'Orsay F-75321 Cedex 07 Paris FR
- Agency: AIR LIQUIDE INTELLECTUAL PROPERTY DEPARTMENT
- Priority: US60/973,092 20070917
- Main IPC: C23C16/18
- IPC: C23C16/18 ; C23C16/455 ; C07F1/08 ; C07F1/12 ; C07F1/10 ; C07F7/08
Abstract:
Methods and compositions for depositing metal films are described herein. In general, the disclosed methods utilize precursor compounds comprising gold, silver or copper. More specifically, the disclosed precursor compounds utilize neutral ligands derived from ethylene or acetylene.
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