A method of manufacturing semiconductor devices by applying a pattern of adhesive pads on an active surface of a semiconductor wafer, the semiconductor wafer product so made and a stacked die package in which an adhesive wall leaves an air gap atop a bottom die. The wall may be in the form of a ring of adhesive about a central hollow area. The wafer carrying the pattern of adhesive pads on its active surface is singulated into individual dies, each die having an adhesive pad thereon. The bottom die is attached to a base with an adhesive which cures without curing the adhesive pad.