An ultra-rapid freezing device (100) adapted for cooling a sample (1), comprises a substrate chip (10) being adapted for cooling the sample (1), and at least one sample carrier (20) being adapted for accommodating the sample (1) and comprising at least one heatable support (21), through which the at least one sample carrier (20) is attached to the substrate chip (10). Preferably, the at least one sample carrier (20) is attached to the substrate chip (10) in a suspended manner. Furthermore, a method of ultra-rapid freezing a sample (1) is described. The at least one sample carrier (20) can be switched between a heated state at which a thermal gradient is formed relative to the substrate chip (10) and a cooled state at which a thermal equilibrium is formed relative to the substrate chip (10).