Invention Application
- Patent Title: SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT
- Patent Title (中): 表面安装包与增强强度焊接接头
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Application No.: PCT/US2008/079336Application Date: 2008-10-09
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Publication No.: WO2009067299A1Publication Date: 2009-05-28
- Inventor: KIM, Patrick , KUHLMAN, Mark, A. , GUO, Yifan , LOBIANCO, Anthony , WARREN, Robert, W.
- Applicant: SKYWORKS SOLUTIONS, INC. , KIM, Patrick , KUHLMAN, Mark, A. , GUO, Yifan , LOBIANCO, Anthony , WARREN, Robert, W.
- Applicant Address: 20 Sylvan Road Woburn, MA 01801 US
- Assignee: SKYWORKS SOLUTIONS, INC.,KIM, Patrick,KUHLMAN, Mark, A.,GUO, Yifan,LOBIANCO, Anthony,WARREN, Robert, W.
- Current Assignee: SKYWORKS SOLUTIONS, INC.,KIM, Patrick,KUHLMAN, Mark, A.,GUO, Yifan,LOBIANCO, Anthony,WARREN, Robert, W.
- Current Assignee Address: 20 Sylvan Road Woburn, MA 01801 US
- Agency: GATES, Sarah, M.
- Priority: US11/942,404 20071119
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead- free solder is used.
Information query
IPC分类:
