Invention Application
WO2009105893A1 SYSTEMS AND METHODS FOR REAL-TIME MONITORING OF DIE USE OR YIELD
审中-公开
用于实时监测DIE使用或损伤的系统和方法
- Patent Title: SYSTEMS AND METHODS FOR REAL-TIME MONITORING OF DIE USE OR YIELD
- Patent Title (中): 用于实时监测DIE使用或损伤的系统和方法
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Application No.: PCT/CA2009/000247Application Date: 2009-03-02
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Publication No.: WO2009105893A1Publication Date: 2009-09-03
- Inventor: LEVENE, Gary S.
- Applicant: ONTARIO DIE INTERNATIONAL INC. , LEVENE, Gary S.
- Applicant Address: 235 Gage Avenue Kitchener , Ontario N2M 2C9 CA
- Assignee: ONTARIO DIE INTERNATIONAL INC.,LEVENE, Gary S.
- Current Assignee: ONTARIO DIE INTERNATIONAL INC.,LEVENE, Gary S.
- Current Assignee Address: 235 Gage Avenue Kitchener , Ontario N2M 2C9 CA
- Agency: BERESKIN & PARR LLP
- Priority: US61/032,320 20080228
- Main IPC: B26F1/38
- IPC: B26F1/38 ; B26D7/28 ; B26F1/44 ; B68F1/00 ; G05B23/02 ; G06K7/10
Abstract:
A method for monitoring die cutting comprising the steps of placing at least one cutting die on a hide, each cutting die having a particular pattern and an RFID (Radio Frequency Identification) tag coupled thereto, each RFID tag containing die-related information about that particular cutting die, repeatedly reading at least one RFID tag to obtain the die-related information for each RFID tag in real-time, based on the die-related information, determining whether the hide is ready for cutting, generating an output based on with whether the hide is ready for cutting, and when the hide is ready for cutting, cutting the hide.
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