The present invention relates to a method of bonding at least a first and a second component (1, 2) to form a bonded structure (6) by,,fusion bonding", comprising the steps of: a) depositing at least one layer (3, 4) preferably having a porous structure onto a surface (1 a, 2a) of at least the first, preferably of each of the components (1, 2), b) roughening of the at least one deposited layer (3, 4), c) bringing together the surface (1 a) of the first component (1 ) with a surface (2a) of the second component (2), and d) bonding of the components (1, 2) to form the bonded structure (6) by,,fusion bonding". Further the invention concerns a bonded structure (6), an optical element and a holding device for a wafer which is made of a bonded structure of this type, as well as a projection lens and a projection exposure system with an optical element of this kind.