MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME

Invention Application

WO2009108707A3 MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME 审中-公开

Title translation: 包括集成薄膜电感器的微型调制器及其制造方法

Please log in to see more content

Patent Title: MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME
Patent Title (中): 包括集成薄膜电感器的微型调制器及其制造方法
Application No.: PCT/US2009035151

Application Date: 2009-02-25
Publication No.: WO2009108707A3

Publication Date: 2009-11-05
Inventor: CAROBOLANTE FRANCESCO , HAWKS DOUGLAS ALAN
Applicant: FAIRCHILD SEMICONDUCTOR , CAROBOLANTE FRANCESCO , HAWKS DOUGLAS ALAN
Assignee: FAIRCHILD SEMICONDUCTOR,CAROBOLANTE FRANCESCO,HAWKS DOUGLAS ALAN
Current Assignee: FAIRCHILD SEMICONDUCTOR,CAROBOLANTE FRANCESCO,HAWKS DOUGLAS ALAN
Priority: US3121208 2008-02-25
Main IPC: H01L23/48
IPC: H01L23/48 ; H01F10/00 ; H01F27/00 ; H01L23/50

MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME

Abstract:

Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.

Abstract(Chinese):

公开了微模块及其制造方法。示例性微模块包括具有薄膜电感器的衬底，以及安装在衬底上和薄膜电感器上的凸起裸片。

Information query

Global Dossier Patent Scope Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/48	.用于向或自处于工作中的固态物体通电的装置，例如引线或接线端装置