Invention Application
- Patent Title: SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY
- Patent Title (中): 支撑安装的电气互连的模具组件
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Application No.: PCT/US2009/036921Application Date: 2009-03-12
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Publication No.: WO2009114670A2Publication Date: 2009-09-17
- Inventor: McELREA, Simon, J.S. , ROBINSON, Marc, E. , ANDREWS, Lawrence, Douglas, Jr.
- Applicant: VERTICAL CIRCUITS, INC. , McELREA, Simon, J.S. , ROBINSON, Marc, E. , ANDREWS, Lawrence, Douglas, Jr.
- Applicant Address: 10 Victor Square Scotts Valley, CA 95066 US
- Assignee: VERTICAL CIRCUITS, INC.,McELREA, Simon, J.S.,ROBINSON, Marc, E.,ANDREWS, Lawrence, Douglas, Jr.
- Current Assignee: VERTICAL CIRCUITS, INC.,McELREA, Simon, J.S.,ROBINSON, Marc, E.,ANDREWS, Lawrence, Douglas, Jr.
- Current Assignee Address: 10 Victor Square Scotts Valley, CA 95066 US
- Agency: KENNEDY, Bill
- Priority: US61/035,989 20080312
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/04
Abstract:
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to an interposed substrate or leadframe, and without solder.
Information query
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