Invention Application
- Patent Title: NON-CEMENTITIOUS INFILL PLATFORM FLOOR SYSTEM
- Patent Title (中): 非常规灌装平台地板系统
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Application No.: PCT/US2008/004826Application Date: 2008-04-14
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Publication No.: WO2009123599A1Publication Date: 2009-10-08
- Inventor: HAYDEN, Michael, R. , BAUER, Nicholaus, B.
- Applicant: STAGING CONCEPTS, INC. , HAYDEN, Michael, R. , BAUER, Nicholaus, B.
- Applicant Address: 7008 Northland Drive, Suite 150 Minneapolis, MN 55428 US
- Assignee: STAGING CONCEPTS, INC.,HAYDEN, Michael, R.,BAUER, Nicholaus, B.
- Current Assignee: STAGING CONCEPTS, INC.,HAYDEN, Michael, R.,BAUER, Nicholaus, B.
- Current Assignee Address: 7008 Northland Drive, Suite 150 Minneapolis, MN 55428 US
- Agency: NICHOLS, Erin, M.
- Priority: US61/072,494 20080331
- Main IPC: E04F15/02
- IPC: E04F15/02 ; E04G1/15
Abstract:
Non-cementitious infill platform floor systems involve one or more floor panels (100) and an understructure. A non-cementitious infill platform floor panel includes a gusset plate (1 10) located at each corner of the panel and a tubular frame (120) arranged over the gusset plates forming a base surface that delineates the shape of the panel. Arranged over the base surface in the shape and area of the panel is an under skin (130), and a layer of plywood (140) is arranged over the under skin. A top skin surface (150) composed of a high strength to weight metal is arranged over the layer of plywood.
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