Invention Application
- Patent Title: TEST OF ELECTRONIC DEVICES WITH BOARDS WITHOUT SOCKETS BASED ON INDEPENDENT MECHANICAL CLIPPING
- Patent Title (中): 基于独立机械剪辑的无插座的电子设备测试
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Application No.: PCT/IB2009005877Application Date: 2009-06-03
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Publication No.: WO2009147518A3Publication Date: 2010-05-27
- Inventor: DI LELLO STEFANO
- Applicant: ELES SEMICONDUCTOR EQUIPMENT S , DI LELLO STEFANO
- Assignee: ELES SEMICONDUCTOR EQUIPMENT S,DI LELLO STEFANO
- Current Assignee: ELES SEMICONDUCTOR EQUIPMENT S,DI LELLO STEFANO
- Priority: ITMI20081013 2008-06-03
- Main IPC: G01R31/319
- IPC: G01R31/319 ; G01R31/28
Abstract:
A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205'). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.
Information query
IPC分类: