Invention Application
- Patent Title: METHOD FOR THE MANUFACTURE OF AN ELECTRONIC ASSEMBLY
- Patent Title (中): 方法用于制造电子组件
-
Application No.: PCT/EP2009056286Application Date: 2009-05-25
-
Publication No.: WO2009153129A3Publication Date: 2010-03-04
- Inventor: SCHAAF ULRICH , KUGLER ANDREAS
- Applicant: BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS
- Assignee: BOSCH GMBH ROBERT,SCHAAF ULRICH,KUGLER ANDREAS
- Current Assignee: BOSCH GMBH ROBERT,SCHAAF ULRICH,KUGLER ANDREAS
- Priority: DE102008002532 2008-06-19
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/60
Abstract:
The invention relates to a method for the manufacture of an electronic assembly, comprising at least one electronic component (9) and also a conductor track structure (7) which is used to make contact with the at least one electronic component (9). The method involves a first step being used to pattern a conductive foil (1) to produce the conductor track structure (7). In a second step, the conductor track structure (7) has the at least one electronic component (9) fitted. In a final step, a further foil is laminated onto the conductive foil (1) fitted with the at least one electronic component (9) on the side on which the conductive foil (1) has the at least one electronic component (9) fitted.
Information query
IPC分类: