Invention Application
WO2010011578A3 COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
审中-公开
用于检查和/或分类WAFER的计算机实现方法
- Patent Title: COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
- Patent Title (中): 用于检查和/或分类WAFER的计算机实现方法
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Application No.: PCT/US2009051044Application Date: 2009-07-17
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Publication No.: WO2010011578A3Publication Date: 2010-04-22
- Inventor: REICH JUERGEN , VINTRO LOUIS , DIGHE PRASANNA , STEINBACH ANDREW , KAVALDJIEV DANIEL , BIELLAK STEPHEN
- Applicant: KLA TENCOR CORP , REICH JUERGEN , VINTRO LOUIS , DIGHE PRASANNA , STEINBACH ANDREW , KAVALDJIEV DANIEL , BIELLAK STEPHEN
- Assignee: KLA TENCOR CORP,REICH JUERGEN,VINTRO LOUIS,DIGHE PRASANNA,STEINBACH ANDREW,KAVALDJIEV DANIEL,BIELLAK STEPHEN
- Current Assignee: KLA TENCOR CORP,REICH JUERGEN,VINTRO LOUIS,DIGHE PRASANNA,STEINBACH ANDREW,KAVALDJIEV DANIEL,BIELLAK STEPHEN
- Priority: US17926008 2008-07-24
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
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