Invention Application
WO2010015401A3 RELAXATION OF STRAINED LAYERS 审中-公开
松弛应变层

RELAXATION OF STRAINED LAYERS
Abstract:
The present invention relates to a method for relaxing a strained material layer, comprising depositing a first low-viscosity layer comprising a first compliant material on the strained material layer, depositing a second low-viscosity layer comprising a second compliant material on the strained material layer to form a first sandwiched structure and subjecting the first sandwiched structure to a heat treatment such that reflow of the first and the second low-viscosity layers is caused thereby at least partly relaxing the strained material layer.
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