Invention Application
- Patent Title: HALO-HYDROCARBON POLYMER COATING
- Patent Title (中): HALO-HYDROCARBON聚合物涂料
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Application No.: PCT/GB2009/001966Application Date: 2009-08-11
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Publication No.: WO2010020753A2Publication Date: 2010-02-25
- Inventor: HUMPHRIES, Mark, Robson , FERDINANDI, Frank , SMITH, Rodney, Edward
- Applicant: SEMBLANT LIMITED , HUMPHRIES, Mark, Robson , FERDINANDI, Frank , SMITH, Rodney, Edward
- Applicant Address: 123 Buckingham Palace Road London SW1W 9SR GB
- Assignee: SEMBLANT LIMITED,HUMPHRIES, Mark, Robson,FERDINANDI, Frank,SMITH, Rodney, Edward
- Current Assignee: SEMBLANT LIMITED,HUMPHRIES, Mark, Robson,FERDINANDI, Frank,SMITH, Rodney, Edward
- Current Assignee Address: 123 Buckingham Palace Road London SW1W 9SR GB
- Agency: KEMP, Paul, Geoffrey
- Priority: GB0815094.8 20080818; GB0815095.5 20080818; GB0815096.3 20080818
- Main IPC: H05K3/28
- IPC: H05K3/28
Abstract:
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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