Invention Application
- Patent Title: ELECTROSTATIC DISCHARGE (ESD) SHIELDING FOR STACKED ICS
- Patent Title (中): 用于堆叠ICS的静电放电（ESD）屏蔽
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Application No.: PCT/US2009/060764Application Date: 2009-10-15
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Publication No.: WO2010045413A1Publication Date: 2010-04-22
- Inventor: TOMS, Thomas R. , JALILIZEINALI, Reza , GU, Shiqun
- Applicant: QUALCOMM INCORPORATED , TOMS, Thomas R. , JALILIZEINALI, Reza , GU, Shiqun
- Applicant Address: International IP Administration 5775 Morehouse Drive San Diego, California 92121 US
- Assignee: QUALCOMM INCORPORATED,TOMS, Thomas R.,JALILIZEINALI, Reza,GU, Shiqun
- Current Assignee: QUALCOMM INCORPORATED,TOMS, Thomas R.,JALILIZEINALI, Reza,GU, Shiqun
- Current Assignee Address: International IP Administration 5775 Morehouse Drive San Diego, California 92121 US
- Agency: TALPALATSKY, Sam
- Priority: US12/251,802 20081015
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/60
Abstract:
An unassembled stacked IC device (60) includes an unassembled tier. (41) The unassembled stacked IC device also includes a first unpatterned layer (610) on the unassembled tier. The first unpatterned layer protects the unassembled tier from ESD events.
Information query
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