Disclosed are semiconductor die packages, systems, and methods therefor. An exemplary package comprises a patterned conductive layer having a first surface, a second surface, and a first thickness between its first and second surfaces; a semiconductor die disposed over the first surface of the patterned conductive layer and electrically coupled thereto; a plurality of conductive bodies disposed at the second surface of the patterned conductive layer and electrically coupled thereto, each conductive body having a thickness that is greater than the first thickness; and a body of electrically insulating material disposed on the semiconductor die and a portion of the first surface of the patterned conductive layer. A further embodiment further comprises a second semiconductor die disposed over the second surface of the patterned conductive layer and electrically coupled thereto.