Invention Application
WO2010062910A2 USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD PROCESS CONTROL 审中-公开
使用光学计量学进给回馈和进给前进过程控制

USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD PROCESS CONTROL
Abstract:
A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
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