Invention Application
- Patent Title: SENSOR NETWORK INCORPORATING STRETCHABLE SILICON
- Patent Title (中): 传感器网络包含可伸缩硅
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Application No.: PCT/US2010/020301Application Date: 2010-01-07
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Publication No.: WO2010096209A1Publication Date: 2010-08-26
- Inventor: VIAN, John, L. , Carralero, Michael, A.
- Applicant: THE BOEING COMPANY , VIAN, John, L. , Carralero, Michael, A.
- Applicant Address: 100 North Riverside Plaza Chicago, Illinois 60606-2016 US
- Assignee: THE BOEING COMPANY,VIAN, John, L.,Carralero, Michael, A.
- Current Assignee: THE BOEING COMPANY,VIAN, John, L.,Carralero, Michael, A.
- Current Assignee Address: 100 North Riverside Plaza Chicago, Illinois 60606-2016 US
- Agency: RAD, Fariba K et al.
- Priority: US12/389,196 20090219
- Main IPC: G01M5/00
- IPC: G01M5/00
Abstract:
A sensor network is described which includes a stretchable silicon substrate, and a plurality of nodes fabricated on the stretchable silicon substrate. The nodes include at least one of an energy harvesting and storage element, a communication device, a sensing device, and a processor. The nodes are interconnected via interconnecting conductors formed in the substrate.
Information query
