Disclosed is a composition for a conductive paste containing micrometer-thick silver microplates (or plate-shaped silver micro particles) surface-modified with metal nano particles. The composition can be sintered at a relatively low temperature between 150 to 300 °C. For this purpose, it needs not more than 65 % silver nano particles per the weight of the composition. The plate-shaped silver micro particles may be replaced with plate-shaped copper micro particles coated with silver. The composition for a conductive paste may comprise solely the metal- modified silver microplates as a conductive material, and further comprise metal nano particles. According to another aspect, the composition may further comprise carbon nanotubes in addition to the metal nano particles. As additional conductive materials, micrometer-size flake-shaped copper and/or silver particles may be further included.