Invention Application
WO2010126302A3 SEMICONDUCTOR PACKAGE WITH NSMD TYPE SOLDER MASK AND METHOD FOR MANUFACTURING THE SAME
审中-公开
具有NSMD型焊接掩模的半导体封装及其制造方法
- Patent Title: SEMICONDUCTOR PACKAGE WITH NSMD TYPE SOLDER MASK AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 具有NSMD型焊接掩模的半导体封装及其制造方法
-
Application No.: PCT/KR2010002683Application Date: 2010-04-28
-
Publication No.: WO2010126302A3Publication Date: 2010-12-29
- Inventor: SHIM SEONG BO , LEE YOUNG JAE , RYU SUNG WUK
- Applicant: LG INNOTEK CO LTD , SHIM SEONG BO , LEE YOUNG JAE , RYU SUNG WUK
- Assignee: LG INNOTEK CO LTD,SHIM SEONG BO,LEE YOUNG JAE,RYU SUNG WUK
- Current Assignee: LG INNOTEK CO LTD,SHIM SEONG BO,LEE YOUNG JAE,RYU SUNG WUK
- Priority: KR20090038392 2009-04-30
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/12 ; H01L23/48
Abstract:
A method for manufacturing semiconductor package comprising: a first step of forming a solder mask formed with an opening on an insulation substrate; and a second step of firmly adhering a solder paste and a metal ball on the solder mask to mount chips thereon, such that a circuit density of a substrate can be greatly increased by directly printing a solder paste on a solder mask following formation of an opening of the solder mask on a trace and can be applied to a fine bump pitch of less than 100µm due to non-existence of bump bridges.
Information query
IPC分类:
