Invention Application
- Patent Title: A BINDING APPARATUS
- Patent Title (中): 装订设备
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Application No.: PCT/EP2010057331Application Date: 2010-05-27
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Publication No.: WO2010136530A3Publication Date: 2011-01-27
- Inventor: GREGERSEN JOHAN C
- Applicant: JBJ MECHATRONIC APS , GREGERSEN JOHAN C
- Assignee: JBJ MECHATRONIC APS,GREGERSEN JOHAN C
- Current Assignee: JBJ MECHATRONIC APS,GREGERSEN JOHAN C
- Priority: EP09161234 2009-05-27; EP10151193 2010-01-20
- Main IPC: E04G21/12
- IPC: E04G21/12 ; B65B13/28
Abstract:
A binding apparatus for binding a wire around one or more objects, the binding apparatus is adapted to bind the wire such that a predetermined tension in the wire is achieved. A method of binding a wire around one or more objects so as to achieve a desired tension of the wire in the binding.
Information query
