Invention Application
- Patent Title: METHODS OF FORMING CAPACITORS
- Patent Title (中): 形成电容器的方法
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Application No.: PCT/US2010/038591Application Date: 2010-06-15
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Publication No.: WO2011002603A2Publication Date: 2011-01-06
- Inventor: ANTONOV, Vassil , BHAT, Vishwanath
- Applicant: MICRON TECHNOLOGY, INC. , ANTONOV, Vassil , BHAT, Vishwanath
- Applicant Address: 8000 South Federal Way Boise, ID 83716 US
- Assignee: MICRON TECHNOLOGY, INC.,ANTONOV, Vassil,BHAT, Vishwanath
- Current Assignee: MICRON TECHNOLOGY, INC.,ANTONOV, Vassil,BHAT, Vishwanath
- Current Assignee Address: 8000 South Federal Way Boise, ID 83716 US
- Agency: MATKIN, Mark, S. et al.
- Priority: US12/496,890 20090702
- Main IPC: H01L21/8242
- IPC: H01L21/8242 ; H01L27/108
Abstract:
A method of forming a capacitor includes depositing a dielectric metal oxide layer of a first phase to a thickness no greater than 75 Angstroms over an inner conductive capacitor electrode material. The first phase dielectric metal oxide layer has a k of at least 15. Conductive RuO2 is deposited over and into physical contact with the dielectric metal oxide layer. Then, the RuO2 and the dielectric metal oxide layer are annealed at a temperature below 50O0C. The RuO2 in physical contact with the dielectric metal oxide during the annealing facilitates a change of the dielectric metal oxide layer from the first phase to a second crystalline phase having a higher k than the first phase. The annealed dielectric metal oxide layer is incorporated into a capacitor dielectric region of a capacitor construction. Other implementations are disclosed.
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