Embodiments provide a method of dicing a wafer having an active surface and an inactive surface opposing the active surface, wherein the active surface comprises components sensitive to at least one of liquid, pressure and vibration. The method includes applying a protecting layer on at least a portion of the inactive surface of the wafer; and dry dicing through the wafer from the inactive surface of the wafer through the protecting layer and the wafer to form a plurality of dies separated from each other.