Invention Application
- Patent Title: EPOXY RESIN COMPOSITIONS
- Patent Title (中): 环氧树脂组合物
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Application No.: PCT/US2010/056102Application Date: 2010-11-10
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Publication No.: WO2011068644A1Publication Date: 2011-06-09
- Inventor: METRAL, Guillaume , FREY, Johann-Wilhelm , HOEVEL, Bernd , HEFNER, Robert, E., Jr. , MULLINS, Michael J
- Applicant: DOW GLOBAL TECHNOLOGIES INC. , METRAL, Guillaume , FREY, Johann-Wilhelm , HOEVEL, Bernd , HEFNER, Robert, E., Jr. , MULLINS, Michael J
- Applicant Address: 2040 Dow Center Midland, MI 48674 US
- Assignee: DOW GLOBAL TECHNOLOGIES INC.,METRAL, Guillaume,FREY, Johann-Wilhelm,HOEVEL, Bernd,HEFNER, Robert, E., Jr.,MULLINS, Michael J
- Current Assignee: DOW GLOBAL TECHNOLOGIES INC.,METRAL, Guillaume,FREY, Johann-Wilhelm,HOEVEL, Bernd,HEFNER, Robert, E., Jr.,MULLINS, Michael J
- Current Assignee Address: 2040 Dow Center Midland, MI 48674 US
- Agency: HUEBSCH, Joseph, C.
- Priority: US61/265,799 20091202
- Main IPC: C08G59/06
- IPC: C08G59/06 ; C08G59/22 ; C08G59/40
Abstract:
An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.
Information query
