Invention Application
WO2011070159A3 METHODS AND A SYSTEM FOR COMPONENT MOUNTING ARRANGEMENT 审中-公开
组件安装方法和系统

METHODS AND A SYSTEM FOR COMPONENT MOUNTING ARRANGEMENT
Abstract:
A method of connecting a component (34) to a molded article may include disposing a component adjacent to a wall (28) of the article being molded, overlapping a portion of the component with a portion of the wall of the article being molded while the wall is still at least partially molten, and permitting the wall of the article being molded to cool with said portion of the component still overlapped by the wall. Preferably, a portion of the component is overlapped on two sides by the wall of the article being molded to firmly retain the component relative to the article after the article is formed. The article may be a receptacle, or any other object, as desired.
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