Invention Application
- Patent Title: CORE FOR MOULDS FOR CASTING
- Patent Title (中): 用于铸造的芯片
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Application No.: PCT/IB2010/055627Application Date: 2010-12-07
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Publication No.: WO2011073852A1Publication Date: 2011-06-23
- Inventor: GUIDETTI, Marco
- Applicant: CASAPPA S.p.A. , GUIDETTI, Marco
- Applicant Address: Via Balestrieri 1 Frazione Lemignano I-43044 Collecchio (parma) IT
- Assignee: CASAPPA S.p.A.,GUIDETTI, Marco
- Current Assignee: CASAPPA S.p.A.,GUIDETTI, Marco
- Current Assignee Address: Via Balestrieri 1 Frazione Lemignano I-43044 Collecchio (parma) IT
- Agency: MONELLI, Alberto
- Priority: ITPR2009A000102 20091214
- Main IPC: B22C9/10
- IPC: B22C9/10 ; B22C9/24 ; F04C2/18
Abstract:
Core for casting moulds, comprising: a body (2) insertable inside a mould to form a cavity (6) for a product (4) obtained by means of casting inside said mould, said body (2) having an external surface (3) forming an imprint (7) of said cavity (6) for the product (4); the external surface (3) has at least one protruding portion (8) having a rounded profile and forming an arcuate undercut (9) in said imprint (7).
Information query
