Invention Application
- Patent Title: HEAT SEALABLE PACKAGING MATERIAL WITH IMPROVED HOT TACK
- Patent Title (中): 具有改进的热封的热封性包装材料
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Application No.: PCT/US2011022658Application Date: 2011-01-27
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Publication No.: WO2011094370A3Publication Date: 2011-12-01
- Inventor: FILES JOHN C , WEBB ANTHONY KEITH
- Applicant: GRAPHIC PACKAGING INT INC , FILES JOHN C , WEBB ANTHONY KEITH
- Assignee: GRAPHIC PACKAGING INT INC,FILES JOHN C,WEBB ANTHONY KEITH
- Current Assignee: GRAPHIC PACKAGING INT INC,FILES JOHN C,WEBB ANTHONY KEITH
- Priority: US30013410 2010-02-01
- Main IPC: B32B27/10
- IPC: B32B27/10 ; B32B27/30 ; B65D65/40 ; B65D81/30
Abstract:
A packaging material includes a substrate and a heat seal layer. The heat seal layer comprises polyvinylidene chloride. The packaging material includes at least about 8 wt% moisture for increasing the hot tack of a seal formed between a first portion of the heat seal layer and a second portion of the heat seal layer relative to a packaging material with less than about 8 wt% moisture. If desired, the packaging material including the at least about 8 wt% moisture may be formed into a roll.
Information query
