Invention Application
- Patent Title: SYSTEMS AND METHODS PROVIDING ARRANGEMENTS OF VIAS
- Patent Title (中): 提供VIAS安排的系统和方法
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Application No.: PCT/US2011024058Application Date: 2011-02-08
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Publication No.: WO2011097630A3Publication Date: 2011-09-29
- Inventor: GU SHIQUN , NOWAK MATTHEW MICHAEL , LISK DURODAMI J , TOMS THOMAS R , RAY URMI , SUH JUNGWON , CHANDRASEKARAN ARVIND
- Applicant: QUALCOMM INC , GU SHIQUN , NOWAK MATTHEW MICHAEL , LISK DURODAMI J , TOMS THOMAS R , RAY URMI , SUH JUNGWON , CHANDRASEKARAN ARVIND
- Assignee: QUALCOMM INC,GU SHIQUN,NOWAK MATTHEW MICHAEL,LISK DURODAMI J,TOMS THOMAS R,RAY URMI,SUH JUNGWON,CHANDRASEKARAN ARVIND
- Current Assignee: QUALCOMM INC,GU SHIQUN,NOWAK MATTHEW MICHAEL,LISK DURODAMI J,TOMS THOMAS R,RAY URMI,SUH JUNGWON,CHANDRASEKARAN ARVIND
- Priority: US70164210 2010-02-08
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/60 ; H01L23/00 ; H01L23/367 ; H01L23/48 ; H01L23/50 ; H01L23/528
Abstract:
A semiconductor chip, (402) includes an array of electrical contacts, (412, 413) and multiple vias (416, 417) coupling at least one circuit in the semiconductor chip to the array of electrical contacts. A first one of the electrical contacts, (412) of the array of electrical contacts is coupled to N vias (416), and a second one of the electrical contacts (413) of the array of electrical contacts is coupled to M vias (417a, 4176). M and N are positive integers of different values.
Information query
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