The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21 ) comprised of the flexible substrate (20) or of a support structure (70) to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21 ); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip (10) to a placement position (30) by means of a directional structure (40) provided on the support face (21 ). In particular the chip (10) is levitated from the support face (21 ) by said air flow or by vibrational contact between the support face (21 ) and the chip (10) induced by said air flow. When the support face (21 ) is comprised by a support structure (70) distinct from the flexible substrate (20), the support face (21 ) is aligned with the flexible substrate (20). Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro-features) can be used to provide local interactions with the micro-part (chip) (10) so as to position micro-parts (10) with reference to micro-features arranged on the flexible substrate (20). The placement method may be applied for self-assembly of chips (10) on the flexible substrate (20), using a reel-to-reel process.