In an injection molding apparatus comprising a clamp plate, a heated manifold and a mold, a system for mounting an actuator to the manifold and the clamp plate, the system comprising: a mount comprised of a thermally conductive material having first and second heat conductive surfaces disposed between the clamp plate and the actuator, the actuator being mounted in thermal communication with the first conductive surface and the clamp plate being mounted in thermal communication with the second conductive surface; the actuator being mounted to the manifold; the second conductive surface of the mount being urged into contact with the clamp plate under a spring force exerted against the actuator.